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Mar. 19, 2025

Nichia will Exhibit and Present at Coiltech Deutschland in Augsburg, Germany

On March 26-27th, Nichia will proudly exhibit at Coiltech Deutschland in Augsburg, Germany. Additionally, Nichia will present its efforts toward improving the magnetic performance of bonded SmFeN magnetic materials on Wednesday, March 26th.

The Coiltech Deutschland event in Augsburg focuses on sustainable energy solutions as a global initiative to tackle humanity's future challenges. It attracts leading industry players in electric motors, transformers, and generators, showcasing top exhibitors. The World Magnetic Conference also presents technical presentations for attendees to gain insights into the latest technological developments.

Included in its exhibit, Nichia will share its full portfolio of the most up-to-date injection bonded SmFeN magnetic materials, which boast process and performance advantages versus conventional rare earth materials. Nichia promises to continue to work towards developing improved magnetic material grades with even higher surface flux density, superior intrinsic coercivity, and reduced cost on a system level.

Nichia will present its efforts to achieve higher magnetic performance of SmFeN compounds for plastic bonded magnets. Through optimizations in SmFeN particle synthesis and coating processes, Nichia has been able to realize improved SmFeN PA12 magnetic materials (AL16C001A), which include a Br of more than 0.85T and a 50% gain in coercivity over the previous generation of magnetic materials.

Event Date & Time:
2025 March 26th, 9:00am - 6:00pm
2025 March 27th, 9:00am - 5:00pm
Venue:
Messe Augsburg
Nichia Booth:
3-C09
Products on Display:
Nichia's Bonded SmFeN Magnetic Materials
Presentation Details:
・ 2025 March 26, 3:25pm, Hall 1
Speaker: Paul File (Senior Account Manager, Nichia America Corp.)
Title: "Developments in Samarium Iron Nitride – Paving the way for the next generation of magnets"

For registration and details:
Coiltech Deutschland, Mar. 26-27, 2025

We look forward to seeing you at the conference.